2d / 3d aoi (izm-20.1) - pr999485-2590-p

Description du marché

1 piece system: A system for automatic surface inspection of structured silicon wafers for defect recognition and 2D and 3D bump, pad and redistribution line structure measurement. The system is to enable 100% inspection and structure measurement of the entire wafer surface. The wafers are handled automatically from the cassette by a robotic handler for 200mm and 300mm wafers. Manual loading is possible for 100mm, 150mm wafers and diced wafers on DISCO frames. Based on the wafer design, the inspection and measurement results as well as the statistical evaluation and parameters are provided graphically and electronically for subsequent process steps. In addition basic requirements are specified for equipment acceptance and performance, for clean room environment, transportation, installation and support. Optional features: - handling of 150 mm wafer size - handling of 100 mm wafer size - handling of diced wafer on film frame - OCR Reader - additional illumination types

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