DirectWriterLaser - PR880006-3240-P
Description du marché
1 piece DirectWriterLaser DirectWriteLaser system for the flexible, accurate and reproducible process chain for heterogeneous chiplet integration with multi-material capability on material sizes up to 200 mm, mainly on LNOI and III/V materials such as InP. DirectWriteLaser systems enable fast and cost-effective generation of binary and vertical 3D resist structures directly on the wafer, overcoming limitations and delays of the physical masks/reticles normally required. Options: 3.1 High resolution writing mode for structures smaller than 1 µm 3.2 Write mode with low resolution for structures in the 4 µm range 3.3 Software package for data preparation (HIMT) 3.4 Extended possibility of data preparation and corrections (binary and gray tone) with suitable software, including the generation of exposure data in binary system format. 3.5 Extension of the warranty by 12 months 3.6 Extension of the warranty by 24 months
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