Flip-chip bonder

Description du marché

Tampere University Foundation sr ('TAU') is inviting tenders for 'Flip-chip bonder'. A die bonder for mounting optoelectronic components epilayer structure down on substrates having pre-deposited Indium or eutectic (Gold-rich) AuSn solder. System must have at least passive alignment tools (i.e., the system does not need to utilize the light emitting or absorbing property of the components in the component alignment stage). System should based on an open platform in hardware and software level to enable TAU to further develop new processes. Moreover, system should enable to use it in a manual operation mode as well as automating a part or the complete process flow.

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