Frame-Prober-System (IPMS-MRS11.2 ) - PR863846-2480-P

Description du marché

1 piece Frame Prober Wafer prober to be used for wafer and substrate fabrication. The ability to probe diced wafers with chips or chiplets on dicing frames film is very important. Optinal service items: 2.7 Loader OCR-Reader Top-Side YES 3.10 Wafer Chuck Optional: Exchangeable Chuck Top Plate YES 3.11 Wafer Chuck Optional: Additional Chuck Top Plate with different customer topology available YES 4.16 Probing Optional: capacitive wafer profiling YES 5.2 Probing 200mm Optional wafer shape flat 57mm (JEIDA) YES 5.4 Probing 200mm Optional extended minimum wafer thickness "≤ 200µm Rating: 100% smallest value , 20% highest value" 5.5 Probing 200mm Optional extended maximum wafer thickness "≥ 1500µm Rating: 100% highest value , 20% smallest value" 8.4 Electrical Interface and remote control Optional remote control over LAN YES 13.1 Extended Warranty An extended warranty of further 24 months should be offered. During the warranty period all support, repair and parts cost should be covered. YES

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