Grinder (ISIT07a.2) + deionized water recycling unit for grinder (ISIT07a.4) - PR879727-2390-P

Description du marché

1 piece grinder (ISIT07a.2) + 1 piece deionized water recycling unit for grinder (ISIT07a.4) The Fraunhofer ISIT is planning to procure an automatic grinder with a high-performance spindle. The planned wafer size to be processed ranges from single chip grinding up to 8" wafers. The spindle must have sufficient power to grind substrates for GaN epitaxy, which predominantly consist of a polycrystalline aluminum nitride core adapted to GaN CTE and CMOS-friendly layers, which is expected at powers above 6 kW. In addition, a water recovery device is to be purchased. On the one hand, this should prevent grinding particles from entering the waste water in an undesirable way and, on the other hand, significantly reduce the amount of waste water produced.

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