ICP-RIE System - PR794574-2590 -W

Description du marché

Developing intelligent active neural implants typically involves an array of tools and techniques to integrate diverse components into a single microsystem. To interconnect these components and to create electrodes which interface with living tissue necessitates etching capabilities. Dry, plasma-based methods are the preferred technique for etching dielectric and metal thin-films as they can reliably ensure the precision required for high-density interconnections and enable the miniaturisation of the overall system.

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