Panel Level Grinder (IZM-68) - PR289446-2590-P

Description du marché

1 piece: Panel Level Grinder The generation of advanvced 2.5 and 3D packages is often based on the exposure of previously buried (embedded, overmolded) structures as e.g. fine pitch pillar bumps, here precision processes are mandatory. For subsequent RDL formation, especially when finest lines and spaces on panel level are needed a planar structure with lowest TTV in the range of only microns is important. The system for grinding on panel level combines thinning and simultaneous planarization of a panel is an essential process step for panel level packaging (PLP) especially for fan-out panel level packaging. Grinding of polymer panels fabricated by molding or more general, lamination with embedded components allows the revealing of embedded structures as chip backsides for direct heatsink attach or through mold vias for backside contacts and therewith stackable packages. In addition it also allows warpage manipulation during panel processing.

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