Plasmapro 100 Cobra

Description du marché

We are purchasing an ICP dry etching machine for the KU cleanroom, to be installed withfluorine-based chemistry within the cleanroom. It will be optimized for the etching silicon nitride structures on both silicon and GaAs substrates during installation. • Compatibility with current cleanroom equipment - Oxford Instruments Plasmalab 100 ICP65 • Be able to process 100mm wafers, as well as individual pieces to specification. • Must realize smooth sidewall structures in Silicon Nitride that are defined by Electron Beam Lithography (EBL). • Optimization for silicon nitride etching, though capable of etching other materials (such as NbTiN.

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