semi-automated wafer prober - PR879710-2390-P

Description du marché

1 Piece semi-automated wafer prober As part of a project, Fraunhofer ISIT is planning to procure a semi-automatic wafer prober. The qualification of chiplet function throughout the processing and their packaging is steady effort. Current setups are limited in the handling of thin wafers (below 300µm) and to capture the increasingly complex characteristics of next gen. chiplets. This waferprober is rated to be compatible with wafer thicknesses down to 50µm and samples sizes from die to 200mm wafers and can support automatic in-die stepping. The chiplets to be characterized cover the application areas from ultra-low-power memory, ultra-high-power conversion, Piezo-/ferroelectric MEMS and in most generic terms increasingly fast switching capabilities. These require precise current and voltage measurement - also at the chuck - below 1µs at voltages and currents in the ranges of up to 1000V and 100A, respectively, to capture the wide application range.

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