Test head with cards and manipulator - PR876327-2440-P

Description du marché

1 Piece. This specification describes the requirements for a semiconductor test system to be used for characterization and test of sensor ICs at the Fraunhofer IIS. The system must provide intefaces that allow connection with a wafer probing system and a Pick-and-Place handler. The system has to be compatible in Hard- and Software to an already existing Advantest V93000 test system in the Fraunhofer-Gesellschaft. Options Installation Conditions AC voltage (preferred specification) Supply-Channels (High Power) Channel count Extendable to at least Supply-Channels (High Power) Extendable voltage range capability per channel (continuous) Supply-Channels (High Power) Extendable voltage range capability per channel (continuous) Supply-Channels (High Resolution) Channel count extendable to at least AWG/Digitizer (High Resolution) AWG Channel count extendable to at least (single-ended/differential) AWG/Digitizer (High Resolution) Digitizer Channel count extendable to at least (single-ended/differential) AWG/Digitizer (High Speed) AWG Channel count extendable to at least (single-ended/differential) AWG/Digitizer (High Speed) Digitizer Channel count extendable to at least (single-ended/differential) Utility I2C-Interface Utility SPI-Interface Interface Cable interface to Pick-and-Place handler interface board: Ability for establishing an appropiate cable interface meeting all other specifications of this document Interface Supplier can provide stiffener for testhead interface for PCB (which has to be developed after acquiring an ATE-system) Manipulator Angle of test head swing in floor plane (additional swing headroom) Additional Requirements Calibration can be done without dissassembling of test head from a wafer prober or a Pick-and-Place handler

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