Vacuum oven (IZM-11.1) - PR891128-2590-P

Description du marché

2 pcs. vacuum oven: The polymer curing oven is used to cure (i.e. polymerize) thin film polymers on wafers. The oven will be able to process different polymers on various substrates like silicon, glass, compound and ceramic wafers with a size of 100mm up to 200mm (300mm optional). The oven should allow a vacuum batch cure under nitrogen atmosphere with oxygen level measurement and it is able to reach temperatures up to 400°C with a temperature uniformity of +/-5K and steep heating and cooling temperature ramps. The vacuum cure condition allows to realize lower cure temperatures due decrease of the activation energy as well as a shorte time for the processing. Optional features: - Machine MTBA (Mean Time Between Assist) > 24 h - Machine MTBF (Mean Time Between Failure) > 300 h - Machine MTTA (Mean time To Assist) < 10 min - Machine MTTR (Mean Time To Repair) < 6 h - Operating time of the machine > 95 % - The system must have a data logging function to record machine performance and machine status (e.g. start time, end time, number of wafers processed, device number used) - The firmware must be able to record system failures (e.g. error number, error message, time of error generation, recovery time). - An oxygen sensor for measurements up to 10 ppm. The data must be displayed on the user interface. - Stainless steel 25-wafer 200mm cassettes and cassette handles - Replaceable HEPA or particle filter - Vacuum pump included - Convection hardening - Cooling ramps of ≥2.5K/min possible - N2 consumption during the entire PI curing process (reference process: 3h@230°C with <25ppm oxygen content during curing) - The mould should have an automatic backup of the operating system, mould settings, recipes and data. -The equipment supplier will provide training for 2 engineers. Certification must be achieved at the end of the training of customer personnel. The following detailed points should be part of the training: - Commissioning procedures - Shutdown procedures - Use of special machine functions - Setting the parameters - Machine setup and changeover - Interpretation of error codes and troubleshooting procedures - Detailed troubleshooting and fault rectification - Maintenance procedures and checks - Programming of recipes

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