Waferbonder (IZM-31 - PR915379-2590-P

Description du marché

This 1 piece equipment is used for highly accurate bonding of wafers with polymer/metal surfaces or different semiconductor material surfaces. Is essential for integration of heterogeneous materials and will include two different bonding chambers (with option to upgrade to four chambers) with capability to apply defined heat, pressure, vacuum and purge gas conditions. The system enables in-line wafer cleaning and plasma activation as well as high precicison wafer to wafer alignment and bonding in fully automatic and semi-automatic precipe controlled processe sequences. Optional features: - Substrate Handling: Software to read and log ID numbers from wafers; For top , bottom or double sided reading; SEMI T1 (barcode), SEMI M12, SEMI M13 (both alphanumeric), SEMI T7 (data matrix code) compliant) - Software: Machine should provide a SECS/GEM interface

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