Waferinspection (IZM-14.1) - PR958425-2590-P

Description du marché

1 piece: Wafer inspection The measuring systems are used for the following tasks: - Measurement of deflection, deformation and stress of bare wafers as well as wafers with applied layers (silicon components or metal layers) on the front and/or back side, - Measurement of the total thickness and TTV of bare wafers, bonded wafers, individual stacks of bonded wafers such as device or handle wafers and wafers with deposited layers that are optically thick, - Measurement of the TSV of trenches with a high aspect ratio (at least 1:30). The system must be equipped with a pattern recognition system for wafer alignment and measurement point alignment. The pattern recognition function must be activated/deactivated in the measurement recipe be activated/deactivated in the measurement recipe. The machine must provide cassette-to-cassette handling with an alignment station and a flipping module. The handler must be able to handle wafers with open areas. The measurement system must be calibrated traceable to a national standard such as PTB, NIST or equivalent. Manual loading of the wafers and measurement according to a recipe must also be possible. Optional features: - Offline software for data analysis and visualisation available. (LV-Pos. 1.15) - The system must be able to measure 300mm wafers with manual loading. (LV-Pos. 3.12)

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